TSMC OIP Ecosystem Forum Santa Clara 2017
September 13, 2017 | Santa Clara, California
The TSMC Open Innovation Platform (OIP) Ecosystem Forum is a one-of-a-kind event that brings together the semiconductor design chain community and TSMC customer executives. The OIP Forum will feature a day-long, three-track technical conference along with an Ecosystem Pavilion that will host up to 80 member companies.
Stop by the eSilicon booth, #807, to hear the latest additions to our FinFET ASIC and IP offerings for high performance networking, computing, AI and 5G infrastructure.
High-Performance Networking and Computing 7FF IP Platform
Highly differentiating TCAM and memory compilers, I/O libraries and PHYs for high-performance, high-bandwidth applications.
8:30 AM & 12:40 PM, booth 807
7FF Combo PHY: High-Bandwidth Memory (HBM) and Low Latency
Complete 2.5D FinFET solution for HBM and low-latency HBM.
10:20 AM and 3:10 PM, booth 807
TSMC OIP Ecosystem Forum
8:00AM – 6:00PM
Santa Clara Convention Center
5001 Great America Parkway
Santa Clara, CA 95054