eSilicon Navigator Webinar – Browse and Buy Semiconductor IP Online
Silicon is revolutionizing semiconductor IP selection and purchasing.
Learn about the challenges of memory subsystem design and what eSilicon is doing to make the process much easier and more predictable.
TSMC OIP 2016: ChipEstimate.com interviews Lisa Minwell, eSilicon
ChipEstimate.com interviews Lisa Minwell on the 2.5D/HBM ecosystem
Enabling the Expanding Cloud: 2.5D Ecosystem for High Bandwidth, eSilicon, IP Talks! DAC 2016
High-bandwidth memory (HBM) achieves higher bandwidth while using less power in a substantially smaller form factor than competing technologies. A 2.5D implementation allows the integration of highly parallel connections to memory stacks inside the package. Join us to hear about real-world 2.5D/HBM chips.
Webinar: CSMC presents their ultra-high voltage (UHV) process technologies
CSMC offers UHV (ultra-high voltage) BCD (bipolar-CMOS-DMOS) processes for high-efficiency appliances and power supplies for AC-DC converter and LED lighting.