Quote and Compare: Free, Automated Online Multi-Project-Wafer Quote System Delivers Instant Pricing
eSilicon’s free, automated online quote system for multi-project wafer (MPW) shuttle services delivers instant, executable quotes. It allows users to evaluate the wafer cost of multiple options in real time at no cost or obligation. Because the form is automated, it also prevents costly user errors. Unlike online estimation tools you might find on other websites, eSilicon stands behind the details of the quotes generated by this system. We deliver a real, ready-to-sign quote.
You’ll get the same information that it can take up to a week to get using a manual process. The service is accessed through user-friendly web or smartphone interfaces. We have recently added standard IC packaging services to the online MPW quote system.
MPWs reduce prototype cost by up to 90 percent versus a full production mask by grouping multiple IC designs on one mask set. The mask costs are shared by multiple program participants and are a good choice in a variety of scenarios:
eSilicon’s MPW services are available online in the following technologies in multiple flavors from TSMC, GLOBALFOUNDRIES, UMC, SMIC, Altis, CSMC and TSI. For more options, please contact us at email@example.com.
+ View the complete table of MPW online technology choices
The following packaging services are available online. Please contact us regarding custom IC packaging or standard packages not listed here.
Once an MPW order is in process, eSilicon’s foundry engineering team provides a number of services to ensure quality in production, including:
When you are ready for volume production, eSilicon’s automated GDSII quoting portal, GDSII Explorer, offers the ability to fully specify the manufacturing process requirements to submit a GDSII design to TSMC. It takes less than 10 minutes to complete the process and receive an executable quote.
Please contact us at firstname.lastname@example.org if you have any questions or want to discuss additional options and services, such as testing, standard IC packages not listed here, custom die packages, seal rings or additional foundry or technology choices.