Brochures

Brochures

Title File size Last modified
eSilicon’s Network-Optimized 7FF IP Platform

eSilicon’s 7nm IP platform delivers a complete ecosystem of networking-optimized IP with high configurability designed in. All IP in the platform is “plug and play,” using the same metal stack, reliability requirements, operating ranges, control interfaces and DFT methodology. This configurability and compatibility results in better performance, higher density and faster time to market.


1.25 MB May 15, 2018
eSilicon’s Network-Optimized 14LPP IP Platform

eSilicon has complete physical IP and 2.5D/HBM2 (high-bandwidth memory) solutions on Samsung 14LPP technology, including high-performance, high-bandwidth network-optimized memory compilers, TCAM, HBM2 PHY and extended-voltage GPIO (EVGPIO).


688.92 KB May 15, 2018
TCAM: Embedded Ternary CAM Compilers to 7nm

eSilicon offers a broad range of silicon-proven, feature-rich, high-performance, high-density, power-optimized embedded 7nm-180nm binary and ternary CAM compilers. Our TCAM compilers provide high-efficiency, cost-effective solutions for applications such as network search engines, cache for network processors, QoS services, classifications, Ethernet, ATM switches and other diverse networking applications.


769.33 KB May 15, 2018
HBM2 PHY on 7FF for TSMC

High-bandwidth memory achieves higher bandwidth while using less power in a substantially smaller form factor than DDR4 or GDDR5. At 14/16nm, HBM2 addresses the bandwidth gap with up to 256 GB/s data rate per memory at 2Gbps pin speed. At 7nm, the pin speed increases to 2.4Gbps with bandwidth up to 307GB/s. Supports 2, 4, or 8 HBM2 stacks.


637.08 KB May 15, 2018
HBM2 PHY on 14LPP for Samsung

eSilicon and its 2.5D ecosystem have complete, silicon-proven high-bandwidth memory solutions: HBM2 PHY IP, ASIC, interposer & 2.5D package design, test & reliability and volume production.


762.13 KB May 14, 2018
HBM2 PHY on 28/16/14/7nm for Samsung & TSMC

eSilicon has a complete 2.5D/HBM2 (high-bandwidth memory) solution: 2.5D ecosystem management, HBM2 PHY, ASIC, interposer and package design through manufacturing. This brochure gives an overview of our HBM2 hardened PHY solutions on Samsung 14LPP, TSMC 7FF, TSMC 16FF+ and TSMC 28HPC. Contact sales@esilicon.com for our full HBM2 PHY data sheet.


494.24 KB May 13, 2018
FinFET ASIC Design & Manufacturing Services

eSilicon manages the design, development and manufacturing of highly complex FinFET ASICs for our customers—system OEMs in networking, computing, artificial intelligence (AI) and 5G infrastructure. To meet the demands of building these monster ASICs, we have created a new model for taking our ASIC customers from RTL to volume production: transparent, collaborative, flexible. We call it the coASIC model.


302.73 KB September 12, 2017